Publications

  • F. Andrieu etal. A review on opportunities brought by 3d-monolithic integration for CMOS device and digital circuit. In ICIDT, Otranto, Italy, June 2018.
  • L. Brunet etal. 3D monolithic integration. In ECS, Seattle, USA, May 2018.
  • L. Brunet etal. Breakthroughs in 3D sequential technology. In IEDM, San Francisco, USA, December 2018.
  • P. Batude etal. 3D sequential integration: Application-driven technological achievements and guidelines. In IEDM, San Francisco, USA, December 2017.
  • P. Batude etal. 3D sequential integration: review of opportunities and technology updates. In D43D Workshop, Grenoble, France, July 2018.
  • P. Vivet etal. Monolithic 3D: an alternative to advanced CMOS scaling, technology perspectives and associated design methodology challenges. In ICECS, Bordeaux, France, December 2018.
  • P. Vivet etal. Advanced 3D Technologies and Architectures for 3D Smart Image Sensors, technology perspectives and associated design methodology challenges. In DATE - Special session '3D Sensor ­ Hardware to Application', Florence, Italy, March 2019.
  • S. Chéramy etal. 3DVLSI, technology and application. In S3S, San Francisco, USA, October 2018.
  • S. Thuriès etal. 3D sequential integration: overview of 65 nm on 28 nm fdsoi mpw architecture and design contributions. In D43D Workshop, Grenoble, France, July 2018.
  • S. Thuriès etal. 3DVLSI CoolCube MPW & design roadmap. In SES - 3DVLSI Open Workshop, San Francisco, USA, October 2018.
  • P. Häfliger. CMOS sequential 3d integration for mixed-signal 'systems-in- cube'. In The Nano Network annual workshop, Tjøme, Norway, June 2018.
  • P. Häfliger. CMOS sequential 3d integration for mixed-signal 'systems-in- cube'. In Korea-EU WS on low-power nanoelectronics, Seoul, South Korea, September 2018.
Published Feb. 18, 2019 9:02 AM - Last modified Feb. 18, 2019 9:03 AM