ESSCIRC/ESSDERC 2020 eductional event

3D-MUSE is contributing an educational event (these are comprising tutorials and workshops) at the 2020 annual ESSCIRC-ESSDERC conference that had been scheduled to take place in Grenoble, 14-18 Sep. Due to the Corona crisis, the educational events shall be held as online live event on 14/15-Sep, while the content is available for registered attendees as prerecorded videos from 7-Sep until 16-Oct.

11. DISSEMINATION WORKSHOP | High Density 3D CMOS Mixed-Signal Opportunities

Live event: Tue 15-Sep 15:00-16:00 CET

Available for streaming 7-Sep until 16-Oct

Chair: Philipp Häfliger (UiO University of Oslo)

Full content duration ~3h


a) Introduction : The 3D-MUSE project

Philipp Häfliger (University of Oslo, Norway)

b) 3D Sequential Integration: towards analog on digital stacking

Camila Cavalcante (CEA LETI, France)

c) Inter-tier coupling effects and shielding in Sequential 3D integration

Petros Sideris (Grenoble INP/IMEP, France)

d) Merging PDKs to build a Multi-Process Multi-Tier 3D design environment

Mehdi Mouhdach (CEA LETI, France), Olivier Billoint (CEA LETI, France)

e) Ultra dense 3D integrated circuits and pixel parallel processing image sensors

Philipp Häfliger (University of Oslo, Norway), Mikkel Mikkelsen (University of Oslo, Norway)

f) Image sensor hybrid bonding and sequential integration

Jean Michailos (STMicroelectronics, France)

g) Design of Standard Cells with 3D Sequential Integration Technology for Multiply-Accumulate Operations

Arturo Prieto (Lund University, Sweden)


Published May 8, 2020 11:57 AM - Last modified Sep. 7, 2020 9:01 AM