3d-museESSCIRC/ESSDERC 2020 eductional event
3D-MUSE is contributing an educational event (these are comprising tutorials and workshops) at the 2020 annual ESSCIRC-ESSDERC conference that had been scheduled to take place in Grenoble, 14-18 Sep. Due to the Corona crisis, the educational events shall be held as online live event on 14/15-Sep, while the content is available for registered attendees as prerecorded videos from 7-Sep until 16-Oct.
11. DISSEMINATION WORKSHOP | High Density 3D CMOS Mixed-Signal Opportunities
Live event: Tue 15-Sep 15:00-16:00 CET
Available for streaming 7-Sep until 16-Oct
Chair: Philipp Häfliger (UiO University of Oslo)
Full content duration ~3h
a) Introduction : The 3D-MUSE project
Philipp Häfliger (University of Oslo, Norway)
b) 3D Sequential Integration: towards analog on digital stacking
Camila Cavalcante (CEA LETI, France)
c) Inter-tier coupling effects and shielding in Sequential 3D integration
Petros Sideris (Grenoble INP/IMEP, France)
d) Merging PDKs to build a Multi-Process Multi-Tier 3D design environment
Mehdi Mouhdach (CEA LETI, France), Olivier Billoint (CEA LETI, France)
e) Ultra dense 3D integrated circuits and pixel parallel processing image sensors
Philipp Häfliger (University of Oslo, Norway), Mikkel Mikkelsen (University of Oslo, Norway)
f) Image sensor hybrid bonding and sequential integration
Jean Michailos (STMicroelectronics, France)
Arturo Prieto (Lund University, Sweden)
