3D integrated systems-in-cube interfacing the real world to electronic devices

3D-MUSE is a Horizon 2020 EU research project that started 1-Jan-2018 and is ending in September 2022.

It is concerned with 'System-in-Cube' (SinC) 3D integrated circuit design in emerging ultra dense sequential/monolithic 3D CMOS technology. The area of applications is 'Smart Sensor Interfaces' (SSI), i.e. SinCs combining multiple sensor read-out channels with considerable processing power serving the rapidly growing need of IoT devices for ever more ways of interacting with the real world.



A short 'elevator talk' from a workshop on 3D-MUSE at the ESSCIRC/ESSDERC 2020 conference explaining the project basics: